THINKANTECH Showcases Multiple GaN Digital Power Solutions at PCIM Asia 2024, Expanding the Frontiers of GaN Applications
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December 16, 2025
THINKANTECH Showcases Multiple GaN Digital Power Solutions at PCIM Asia 2024, Expanding the Frontiers of GaN Applications
PCIM Asia 2024 - Shenzhen International Exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management was held from August 28-30, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an).
The exhibition brought together leading global and domestic power semiconductor companies, including Infineon, STMicroelectronics, and THINKANTECH, showcasing cutting-edge innovations in power device applications.
THINKANTECH Highlights at PCIM Asia 2024
At the exhibition, THINKANTECH presented a comprehensive portfolio of products, including:
GaN HEMT devices SiC MOSFETs SiC Schottky Barrier Diodes (SBDs) IGBT modules Power topology-based system solutions
Visitors were introduced to dozens of new products across three levels:
Discrete semiconductor devices Power driver modules Topology-level integrated modules
Among them, THINKANTECH's high power density GaN power solutions stood out, attracting significant attention from customers and industry professionals.
Product Portfolio by Application Level
1. Discrete Devices
THINKANTECH leverages wide-bandgap power semiconductor technologies (SiC & GaN), extending their applications into a full range of supporting power solutions.
The company has developed a comprehensive product lineup, including low-voltage MOSFETs, IGBT modules, and GaN and SiC devices.
This enables customers to benefit from a one-stop procurement solution for power semiconductors, along with full technical support.
2. Highly Integrated Intelligent Power Modules
In high-frequency GaN applications, PCB layout complexity and EMC challenges have long limited broader adoption.
To address these issues, THINKANTECH has developed a range of topology-level, highly integrated intelligent power modules, including Boost PFC modules, Half-bridge LLC modules, Full-bridge LLC modules
These GaN-based power modules enable rapid power supply design across different power levels and topologies.
3. Topology-Level Integrated PCBA Power Modules
To enhance flexibility for system integrators, THINKANTECH has introduced a series of circuit topology-based power modules with proprietary intellectual property.
These modules are tailored to common market power requirements and provide faster design cycles, simplified system integration, and ready-to-deploy solutions for target applications.
4. Complete Power System Solutions
As demand grows for high-efficiency, compact, and environmentally friendly power systems, THINKANTECH continues to innovate with fully proprietary designs.
The company has developed a wide range of power conversion topologies, including Boost PFC, Totem-pole PFC, Vienna PFC, Three-level interleaved DC-DC, CLLC resonant converters, Phase-shifted full-bridge, and Full-bridge LLC converter.
In addition, THINKANTECH provides complete hardware and software development platforms, enabling customers to accelerate product development and achieve rapid mass production.
Driving the Future of Power Electronics
The power semiconductor industry is evolving rapidly. As demand increases for compact, high-efficiency power solutions, THINKANTECH continues to overcome technical challenges in high power density design, significantly expanding both the breadth and depth of GaN applications.
Looking ahead, these innovations will contribute to a future of greener, more efficient energy utilization.
Contact
Nanjing HQ: +86-25-51180705
Shenzhen Office: +86-755-36991759
Email: xinkansen@x-ipm.com
Website: https://x-ipm.com
