ABOUT

ABOUT FORMITEK

FORMITEK advances power conversion through wide-bandgap (WBG) innovation, prioritizing power density and mission-critical reliability.

FORMITEK
POWERING THE NEXT FRONTIER

FORMITEK follows a vertically integrated approach, spanning wide-bandgap semiconductor devices through to complete power systems. This structure brings together expertise across semiconductor and system-level engineering to support consistent performance and product quality. Ongoing development focuses on improving conversion efficiency, power density, and thermal performance through optimization at each stage of design.

Milestones & Certifications

• 2022 - Recognized as an Enterprise Above Designated Size

• 2023 - Awarded National Technology-Based SME and National High-Tech Enterprise status; Certified under the ISO 9001 Quality Management System

• 2024 - Successfully obtained IATF 16949 Automotive Quality Management System certification; Recipient of the ASPENCORE China IC Design Achievement Award

• 2025 - Recognized as a Jiangsu Province Potential Unicorn Enterprise and Jiangsu Province Innovative Enterprise

FORMITEK specializes in high-power-density, high-efficiency power electronics, delivering advanced semiconductor modules for power conversion and distribution systems in key application areas:

• Marine Electronics: Power solutions designed for reliability in marine environments and electric vessels.

• Smart Mobility: High-efficiency power solutions for advanced transportation systems.

• AI Computing Infrastructure: High-density power solutions designed for demanding processing environments.

• Consumer Electronics: Compact, high-efficiency power adapters and systems.

• Power Systems: Scalable energy distribution solutions for industrial applications.

Mission

Advancing efficient energy systems through power technology

Vision

Improving efficiency through integration. Ensuring stable performance through reliability. Advancing power technologies through continuous development.

Values

Through advanced technology and reliable products, we support efficient and integrated power solutions.

ACHIEVEMENTS & MILESTONES

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Number of Product Series as of 2025

100 +

Proprietary Patents as of 2025

120 +

Projects Completed as of 2025

600 +

R&D Investment Ratio

35 %

Annual Revenue as of 2025

20,000 K+

Total Production Workshop Area

5,000 +m²

VERTICAL INTEGRATION
AND INDUSTRIAL COLLABORATION

THINKANTECH

THINKANTECH is a subsidiary of FORMITEK, specializing in the design, development, and manufacturing of power semiconductor devices and modules.

FORMITEK

FORMITEK is an industrial group focused on power electronics, developing power technologies designed for high efficiency, compact form factors, and reliable performance.

ZF Testing

ZF Testing is a subsidiary of FORMITEK specializing in reliability testing of semiconductor devices and modules.

COMPANY DEVELOPMENT

2025

Dec.

Received the GaN Technology Breakthrough Award in the power supply industry for our proprietary gallium nitride (GaN) chips.

Honored with the Wide Bandgap Semiconductor Market Development Leadership Award in recognition of our outstanding market expansion capabilities and strong product competitiveness.
Nov.

Participated in the 2025 China Power Supply Society Conference, showcasing power electronics technologies and industry development trends.
Oct.

Awarded dual honors as a 2025 Jiangsu Province Potential Unicorn Enterprise and 2025 Innovative SME.
Sep.

THINKANTECH and Renesas Electronics jointly showcased at Elexcon 2025 Shenzhen International Electronics Exhibition.
Aug.

THINKANTECH and Renesas Electronics jointly showcased at Elexcon 2025 Shenzhen International Electronics Exhibition.
Jul.

Successfully achieved the full-year 2025 sales target ahead of schedule.
Mar.

At the 2025 China IC Design Achievement Awards, THINKANTECH’s GaN Power Module X3G65045HMB (650V / 45mΩ / Half-Bridge Module) won the Best Power Device / Wide-Bandgap Device of the Year Award.

Debuted at APEC (USA), with products and technologies gaining strong international recognition.

2024

Dec.

Awarded the 2024 Wide-Bandgap Semiconductor Application Breakthrough Award.
Jul.

Yancheng module packaging plant began mass production.
Jun.

Signed a strategic cooperation agreement with Renesas Electronics to jointly establish a Wide-Bandgap Semiconductor Digital Power Laboratory.

Entered the supplier list of leading automotive OEMs.
May

Achieved IATF 16949 Automotive Quality Management System Certification.
Apr.

Included in the global data center leading supplier whitelist.

2023

Dec.

Certified as a National High-Tech Enterprise.
Nov.

Obtained ISO 9001 Quality Management System Certification.
Feb.

Received the Power Device Industry Rising Star Award and SiC Industry Excellence Award.
Jan.

Named among China’s Top 10 GaN Power Device Companies.

Entered the Top 5 supplier list for main-drive electric powertrain systems.

2022

Dec.

Cumulative shipments exceeded 2 million units of SiC MOSFETs and 1 million units of GaN devices.
Apr.

Recognized as a China SME Growth Benchmark Enterprise.

2021

Dec.

SiC MOSFET products entered mass production and shipment.
Nov.

Company headquarters relocated to Nanjing Headquarters Base.
Jul.

First batch of GaN products entered mass shipment.
Apr.

Shenzhen office officially opened.

2020

Oct.

Company founded in Suzhou.